The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Oct. 15, 2013
Kingpak Technology Inc., Chu-Pei, Hsin-Chu Hsien, TW;
Chun-Lung Huang, Hsin-Chu Hsien, TW;
Hsiu-Wen Tu, Hsin-Chu Hsien, TW;
Cheng-Chang Wu, Hsin-Chu Hsien, TW;
Chung-Yu Yang, Hsin-Chu Hsien, TW;
Rong-Chang Wang, Hsin-Chu Hsien, TW;
Jo-Wei Yang, Hsin-Chu Hsien, TW;
Kingpak Technology Inc., Hsin-chu Hsien, TW;
Abstract
A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.