The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Nov. 21, 2017
Kingpak Technology Inc., Hsin-Chu County, TW;
Jian-Ru Chen, Hsin-Chu County, TW;
Jo-Wei Yang, Hsin-Chu County, TW;
Li-Chun Hung, Hsin-Chu County, TW;
Hsiu-Wen Tu, Hsin-Chu County, TW;
Chung-Hsien Hsin, Hsin-Chu County, TW;
KINGPAK TECHNOLOGY INC., Hsin-Chu, TW;
Abstract
A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.