The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Apr. 22, 2019
Kingpak Technology Inc., Hsin-Chu County, TW;
Sheng Yang, Hsin-Chu County, TW;
Li-Chun Hung, Hsin-Chu County, TW;
Hsiu-Wen Tu, Hsin-Chu County, TW;
Jo-Wei Yang, Hsin-Chu County, TW;
Chien-Chen Lee, Hsin-Chu County, TW;
Jian-Ru Chen, Hsin-Chu County, TW;
KINGPAK TECHNOLOGY INC., Hsin-Chu County, TW;
Abstract
A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.