This inventor holds 12 USPTO granted patents. Top assignees: Kingpak Technology Inc., Other. Active years: 2003-2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Chupei, Hsinchu Hsien, TW (2003)
- Hsinchu Hsien, TW (2003 - 2009)
- Hsin-Chu County, TW (2019)
Company Filing History:
9 out of 81 
3 out of 834,659 Years Active: 2003-2019
Title: Hsiu Wen Tu: Innovator in Optical Package Structures
Introduction
Hsiu Wen Tu is a prominent inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of optical packaging, holding a total of 12 patents. His innovative designs have advanced the technology used in optical units and image sensor modules.
Latest Patents
One of Hsiu Wen Tu's latest patents is an optical package structure. This structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate, and an encapsulation layer. The frame layer, formed on the substrate, surrounds a cavity where the optical unit is located. The bonding layer covers a portion of the upper edge of the frame layer while exposing the other portion. The transparent plate, mounted on the bonding layer, extends across the optical unit and beyond the outer edge of the bonding layer. The encapsulation layer covers the lateral edge of the transparent plate and the outer edge of the bonding layer.
Another notable patent is an image sensor module with an air escape hole and a method for manufacturing the same. This module includes a substrate with an upper and lower surface, where a chip is mounted on the upper surface. A plurality of wires electrically connects the chip to the substrate. An adhered layer is coated on the upper surface, and a lens holder is mounted on it. The lens holder features a top wall with an air escape hole, while a lens barrel is formed with an external thread that screws onto the internal thread of the lens holder. Additionally, filled glue is used within the air escape hole of the lens holder.
Career Highlights
Hsiu Wen Tu has worked with Kingpak Technology Inc., where he has contributed to various innovative projects. His work has been instrumental in developing advanced optical packaging solutions that enhance the performance of optical devices.
Collaborations
Hsiu Wen Tu has collaborated with notable coworkers, including Mon Nan Ho and Jichen Wu. Their teamwork has fostered an environment of innovation and creativity in their projects.
Conclusion
Hsiu Wen Tu is a distinguished inventor whose work in optical package structures and image sensor modules has made a significant impact in the field. His patents reflect his commitment to advancing technology and improving optical systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile