The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Apr. 16, 2001
Hsiu Wen Tu, Hsinchu Hsien, TW;
Wen Chuan Chen, Hsinchu Hsien, TW;
Mon Nan Ho, Hsinchu Hsien, TW;
Li Huan Chen, Hsinchu Hsien, TW;
Jichen Wu, Hsinchu Hsien, TW;
Meng Ru Tsai, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.