Wen Chuan Chen is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of image sensor packaging, holding a total of 8 patents. His work focuses on improving the efficiency and cost-effectiveness of packaging structures for image sensors.

Latest Patents

Wen Chuan Chen's latest patents include innovative packaging structures for image sensors. One of his patents describes a packaging structure that consists of a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. This design simplifies the packaging processes and lowers manufacturing costs by utilizing plastic materials. Another patent details a package structure where the image sensing chip is directly packaged on a flexible circuit board using flip chip bonding. This structure allows for efficient signal transmission from the image sensing chip to the printed circuit board, enhancing the overall performance of the image sensor.

Career Highlights

Throughout his career, Wen Chuan Chen has worked with various companies, including Kingpak Technology Inc. His expertise in image sensor technology has positioned him as a key player in the industry, contributing to advancements that benefit both manufacturers and consumers.

Collaborations

Wen Chuan Chen has collaborated with notable colleagues, including Jichen Wu and Hsiu Wen Tu, who have contributed to his innovative projects and research in the field of image sensors.

Conclusion

Wen Chuan Chen's contributions to image sensor packaging demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of the technology and a drive to improve manufacturing processes.

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