The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Jan. 23, 2001
Mon Nan Ho, Hsinchu Hsien, TW;
Chih-Hong Chen, Hsinchu Hsien, TW;
Yen Cheng Huang, Hsinchu Hsien, TW;
Li Huan Chen, Hsinchu Hsien, TW;
Kuo Feng Peng, Hsinchu Hsien, TW;
Jichen Wu, Hsinchu Hsien, TW;
Allis Chen, Hsinchu Hsien, TW;
Wen Chuan Chen, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.