Hsinchu, Taiwan

Yen Cheng Huang

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: Kingpak Technology Inc., Other. Active years: 2002-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yen Cheng Huang. Retrieved from https://idiyas.com/inventor/yen-cheng-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 8.6

ph-index = 3

Forward Citations = 51(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (2002 - 2003)
  • Chupei, Hsinchu Hsien, TW (2003)

Company Filing History:


Years Active: 2002-2003

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3 patents (USPTO):Explore Patents

Title: Yen Cheng Huang: Innovator in Image Sensor Technology

Introduction

Yen Cheng Huang is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of image sensor technology, holding a total of 3 patents. His innovative designs have paved the way for advancements in how image sensors are integrated into electronic devices.

Latest Patents

Huang's latest patents include a stacked package structure of an image sensor designed for efficient electrical connection to a printed circuit board. This innovative structure consists of a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The design allows the image sensing chip to receive image signals through the transparent layer, converting them into electrical signals that are transmitted to the first substrate. This integration enhances the performance and compactness of image sensing products.

Another patent by Huang describes a similar stacked package structure of an image sensor, which also includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. This design features signal input and output terminals for seamless connection to a printed circuit board. The image sensing chip is mounted on the substrate's first surface, while the integrated circuit is arranged on the second surface, ensuring efficient signal processing and transmission.

Career Highlights

Throughout his career, Yen Cheng Huang has worked with various companies, including Kingpak Technology Inc. His experience in the industry has allowed him to refine his skills and contribute to cutting-edge technologies in image sensing.

Collaborations

Huang has collaborated with talented individuals such as Wen Chuan Chen and Mon Nan Ho, who have contributed to his projects and innovations in the field.

Conclusion

Yen Cheng Huang's work in image sensor technology exemplifies the spirit of innovation and dedication to advancing electronic design. His patents reflect a commitment to improving the functionality and efficiency of image sensing products, making a lasting impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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