The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2003
Filed:
Jan. 24, 2001
Hsiu Wen Tu, Hsinchu Hsien, TW;
Wen Chuan Chen, Hsinchu Hsien, TW;
Mon Nan Ho, Hsinchu Hsien, TW;
Li Huan Chen, Hsinchu Hsien, TW;
Nai Hua Yeh, Hsinchu Hsien, TW;
Yen Cheng Huang, Hsinchu Hsien, TW;
Yung Sheng Chiu, Hsinchu Hsien, TW;
Jichen Wu, Hsinchu Hsien, TW;
Joe Liu, Hsinchu Hsien, TW;
Wu Hsiang Lee, Hsinchu Hsien, TW;
Other;
Abstract
A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.