Location History:
- Chupei, Hsinchu Hsien, TW (2003)
- Hsinchu Hsien, TW (2002 - 2004)
Company Filing History:
2 out of 81 
3 out of 832,961 Years Active: 2002-2004
Title: Innovations by Li Huan Chen in Image Sensor Packaging
Introduction
Li Huan Chen is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of image sensor packaging, holding a total of 5 patents. His work focuses on improving the efficiency and cost-effectiveness of packaging structures for image sensors.
Latest Patents
One of his latest patents is titled "Packaging structure of image sensor and method for packaging the same." This invention features a packaging structure that includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate is designed with multiple metal sheets and glue for sealing, allowing for effective electrical connections. The transparent layer is positioned above the image sensing chip, facilitating a simplified packaging process that reduces manufacturing costs.
Another significant patent is the "Stacked package structure of image sensor." This design involves a first substrate and a second substrate that create a cavity for an integrated circuit and an image sensing chip. The transparent layer covers the image sensing chip, enabling it to receive image signals and convert them into electrical signals. This innovative approach allows for an integrated packaging solution that enhances the functionality of image sensing products.
Career Highlights
Li Huan Chen has worked with various companies, including Kingpak Technology Inc. His experience in the industry has allowed him to develop cutting-edge technologies that address the challenges in image sensor packaging.
Collaborations
Throughout his career, Li has collaborated with talented individuals such as Wen Chuan Chen and Mon Nan Ho. These partnerships have contributed to the advancement of his innovative projects.
Conclusion
Li Huan Chen's contributions to the field of image sensor packaging demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of the technical challenges in this area, paving the way for future advancements.