Joe Liu

Title: Joe Liu: Image Sensor Packaging Inventor

Introduction

Joe Liu is an inventor associated with Hsinchu, Taiwan. His work includes image sensor packaging technologies, and he is credited with 3 patents.

Latest Patents

Liu’s listed patents focus on packaging structures that integrate image-sensing chips with supporting substrates and circuitry.

“Packaging Structure of Image Sensor and Method for Packaging the Same” describes a package using a substrate made from metal sheets sealed with glue, an image-sensing chip, electrical connections, and a transparent layer. The design enables a plastic-based image sensor package intended to simplify manufacturing processes and reduce costs.

“Stacked Package Structure of Image Sensor” describes a stacked arrangement with two substrates, an integrated circuit housed in a cavity, an image-sensing chip, and a transparent cover. The structure integrates the image sensor and integrated circuit in one package, while allowing the sensor to receive image signals and transmit corresponding electrical signals.

Career Highlights

Liu’s listed professional experience includes Kingpak Technology Inc. His patent work reflects an emphasis on packaging approaches for image sensors and related electronic components.

Collaborations

Mon Nan Ho and Hsiu Wen Tu are identified as Liu’s coworkers. The available information does not specify their roles in the listed patents.

Conclusion

Joe Liu’s patent portfolio highlights practical image sensor packaging designs, including plastic-based and stacked structures intended to support integration and efficient manufacturing.