The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Dec. 04, 2001
Mon Nan Ho, Hsinchu Hsien, TW;
Hsiu Wen Tu, Hsinchu Hsien, TW;
Kuo Feng Feng, Hsinchu Hsien, TW;
Yung Sheng Chiu, Hsinchu Hsien, TW;
Joe Liu, Hsinchu Hsien, TW;
Nai Hua Yeh, Hsinchu Hsien, TW;
Wen Chuan Chen, Hsinchu Hsien, TW;
Allis Chen, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.