Kuo Feng Peng

Title: Kuo Feng Peng: Inventor in Image Sensor and Integrated Circuit Packaging

Introduction

Kuo Feng Peng is an inventor associated with Hsinchu, Taiwan. His patent work includes packaging technologies for image sensors and integrated circuits. He is credited with 3 patents.

Latest Patents

Package Structure of an Image Sensor and Packaging. This invention describes an image-sensor chip mounted directly onto a flexible circuit board using flip-chip bonding. A transparent layer covers the board, allowing the chip to receive image signals and convert them into electrical signals. The flexible circuit board then carries those signals to a printed circuit board.

Substrate Structure for an Integrated Circuit Package and Method for Manufacturing the Same. This invention uses metal sheets sealed with glue to form a substrate that connects an integrated circuit to a circuit board. The exposed surfaces of the metal sheets serve as signal input and output terminals. The design aims to support reliable electrical connections and shorten the signal transmission distance.

Career Highlights

Peng’s listed company experience includes Kingpak Technology Inc. The supplied information also mentions another organization as “Other,” which is not included as a company name.

Collaborations

Peng’s listed coworkers include Wen Chuan Chen and Jichen Wu.

Conclusion

Kuo Feng Peng’s patent portfolio focuses on practical packaging structures for image sensors and integrated circuits, with an emphasis on electrical connections and signal transmission.