Chih-Hong Chen

Title: Chih-Hong Chen: Semiconductor and Integrated Circuit Packaging Inventor.

Introduction

Chih-Hong Chen is an inventor based in Hsinchu, Taiwan. His work includes innovations in integrated circuit packaging and polysilicon thin-film transistor design. He holds 3 patents.

Latest Patents

Chen’s patent “Substrate Structure for an Integrated Circuit Package and Method for Manufacturing the Same” describes a substrate made from metal sheets sealed with glue. The exposed surfaces of the sheets form signal input terminals for connecting to an integrated circuit and signal output terminals for connecting to a circuit board. The design aims to simplify electrical connections and shorten the signal transmission distance between the integrated circuit and the board. The patent also discloses a method for manufacturing the substrate.

His patent “Polysilicon Thin Film Transistor with a Self-Aligned LDD Structure” describes a transistor built on a transparent insulating substrate. Its design includes a polysilicon layer with a channel, a lightly doped drain structure, and source and drain regions, along with a gate and insulating spacer. The self-aligned structure positions the lightly doped drain around the channel.

Career Highlights

Chen’s career includes work with the Industrial Technology Research Institute and Kingpak Technology Inc. His patent portfolio reflects contributions to semiconductor devices and integrated circuit packaging.

Collaborations

Chen’s listed coworkers include Mon Nan Ho and Yen Cheng Huang, reflecting collaborative connections in his professional work.

Conclusion

Chih-Hong Chen’s patents address practical challenges in circuit packaging and transistor architecture, highlighting his contributions to semiconductor innovation in Taiwan.