The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jun. 15, 2017
Applicant:

Kingpak Technology Inc., Hsin-Chu County, TW;

Inventors:

Hsiu Wen Tu, Hsin-Chu County, TW;

Chung-Hsien Hsin, Hsin-Chu County, TW;

Jina-Ru Chen, Hsin-Chu County, TW;

Assignee:

KINGPAK TECHNOLOGY INC., Hsin-Chu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 23/3128 (2013.01); H01L 24/73 (2013.01); H01L 27/14636 (2013.01); H01L 31/0203 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An optical package structure is provided. The optical package structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate and an encapsulation layer. The frame layer formed on the substrate surrounds a cavity where the optical unit is located. The bonding layer covers a portion of an upper edge of the frame layer and exposes the other portion of the upper edge of the frame layer. The transparent plate mounted on the bonding layer extends across the optical unit and extends beyond an outer edge of the bonding layer. The encapsulation layer covers a lateral edge of the transparent plate and the outer edge of the bonding layer.


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