The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Apr. 01, 2002
Jason Chuang, Hsinchu Hsien, TW;
Allis Chen, Hsinchu Hsien, TW;
Jachson Hsieh, Hsinchu Hsien, TW;
Hsiu Wen Tu, Hsinchu Hsien, TW;
Meng Ru Tsai, Hsinchu Hsien, TW;
Mon Nan Ho, Hsinchu Hsien, TW;
Fu Yung Huang, Hsinchu Hsien, TW;
Yung Sheng Chiu, Hsinchu Hsien, TW;
Jichen Wu, Hsinchu Hsien, TW;
Chih Cheng Hsu, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.