Fu Yung Huang

Title: Fu Yung Huang: Innovator in Memory Module and Photosensitive Chip Technologies

Introduction

Fu Yung Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in memory modules and photosensitive chip structures. With a total of 2 patents, his work showcases innovative solutions that enhance memory capacity and manufacturing processes.

Latest Patents

One of Fu Yung Huang's latest patents is a memory module structure designed for assembly on a locking device. This invention includes a substrate with notches on its short sides, allowing for secure attachment by the locking device. The design accommodates a plurality of memories, some of which are transversely mounted while others are longitudinally mounted on the substrate. This arrangement effectively increases the memory capacity of the memory module.

Another significant patent is a package structure for a photosensitive chip. This structure features a substrate with an upper and lower surface, along with a frame layer formed through injection molding. A cavity is created between the substrate and the frame layer, housing a photosensitive chip and connecting wires. The design includes a transparent layer resting on projections within a depression, which improves yield and facilitates manufacturing processes.

Career Highlights

Fu Yung Huang is currently employed at Kingpak Technology Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of memory modules and photosensitive chips.

Collaborations

Fu Yung Huang collaborates with talented individuals such as Ren Long Kau and May Chen. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Fu Yung Huang is a distinguished inventor whose work in memory module and photosensitive chip technologies has made a significant impact in the field. His innovative patents reflect his commitment to enhancing technology and improving manufacturing processes.