The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2003

Filed:

Nov. 21, 2001
Applicant:
Inventors:

Nai Hua Yeh, Hsinchu Hsien, TW;

Chen Pin Peng, Hsinchu Hsien, TW;

Chief Lin, Hsinchu Hsien, TW;

C. S. Cheng, Hsinchu Hsien, TW;

Kuang Yu Fan, Hsinchu Hsien, TW;

Ren Long Kau, Hsinchu Hsien, TW;

Fu Yung Huang, Hsinchu Hsien, TW;

Yves Huang, Hsinchu Hsien, TW;

Wu Hsiang Lee, Hsinchu Hsien, TW;

Chih Hsien Chung, Hsinchu Hsien, TW;

May Chen, Hsinchu Hsien, TW;

Assignee:

Kingpak Technology, Inc., Hsinchu Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/1072 ;
U.S. Cl.
CPC ...
H01L 3/1072 ;
Abstract

A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.


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