Chief Lin

Title: Chief Lin - Innovator in Image Sensor and Memory Module Technologies

Introduction

Chief Lin is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the fields of image sensor packaging and memory module structures. With a total of 3 patents to his name, Chief Lin continues to push the boundaries of technology through his innovative designs.

Latest Patents

Chief Lin's latest patents include a substrate structure for an image sensor package and a memory module structure. The substrate structure for an image sensor package features a bottom base with first and second electrodes, along with an insulation layer that enhances the functionality of the device. This design allows for a cavity to be formed, optimizing the performance of the image sensor. The memory module structure is designed for assembly on a locking device, incorporating a substrate with notches for secure attachment. This innovative arrangement of memories increases the overall memory capacity of the module, showcasing Chief Lin's expertise in efficient design.

Career Highlights

Throughout his career, Chief Lin has worked with various companies, including Kingpak Technology Inc. His experience in the industry has allowed him to develop cutting-edge technologies that address the needs of modern electronics.

Collaborations

Chief Lin has collaborated with talented individuals such as Nai Hua Yeh and Chen Pin Peng. These partnerships have contributed to the successful development of his innovative projects.

Conclusion

Chief Lin is a distinguished inventor whose work in image sensor and memory module technologies has made a significant impact in the field. His innovative patents and collaborations reflect his commitment to advancing technology.