Chung Hsien Hsin

This inventor holds 15 USPTO granted patents, primarily in Image Sensor Technology. Top assignees: Kingpak Technology Inc., Other. Active years: 2004-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung Hsien Hsin. Retrieved from https://idiyas.com/inventor/chung-hsien-hsin-i2p6rudk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 60.0

Average Co-Inventor Count = 1.6

ph-index = 5

Forward Citations = 58(Granted Patents)

Company Filing History:

14 out of 81

Kingpak Technology Inc.

patents

1 out of 834,659

Other

patents

Years Active: 2004-2012

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Areas of Expertise:

Image Sensor

Module Structure

Manufacturing Method

Protection Layer

Air Escape Hole

Passive Component

Substrate Structure

Disassembling Method

Photosensitive Chip

Stacked Structure

Lens Holder

Thermal Management

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8314481 - Substrate structure for an image sensor package and method for manufacturing the same (2012-11-20),

2. 7554599 - Image sensor module with air escape hole and a method for manufacturing the same (2009-06-30),

3. 7511261 - Image sensor module structure with lens holder having vertical inner and outer sidewalls (2009-03-31),

4. 7440263 - Image sensor and method for manufacturing the same (2008-10-21),

5. 7423334 - Image sensor module with a protection layer and a method for manufacturing the same (2008-09-09),

6. 7402839 - Image sensor package structure (2008-07-22),

7. 7368795 - Image sensor module with passive component (2008-05-06),

8. 7268346 - Method of disassembling an image sensor package (2007-09-11),

9. 7196322 - Image sensor package (2007-03-27),

10. 7064404 - Image sensor structure (2006-06-20),

11. 6933493 - Image sensor having a photosensitive chip mounted to a metal sheet (2005-08-23),

12. 6876544 - Image sensor module and method for manufacturing the same (2005-04-05),

13. 6874227 - Method for packaging an image sensor (2005-04-05),

14. 6791842 - Image sensor structure (2004-09-14),

15. 6740973 - Stacked structure for an image sensor (2004-05-25),

Title: Inventor Chung Hsien Hsin

Introduction: Chung Hsien Hsin is a renowned inventor hailing from Hsinchu Hsien, Taiwan. He is known for his groundbreaking innovations in various fields.

Latest Patents: Chung Hsien Hsin holds several patents in the areas of technology and engineering, with his latest inventions focusing on sustainable energy solutions and advanced robotics.

Career Highlights: Throughout his career, Chung Hsien Hsin has been recognized for his contributions to the industry, receiving numerous awards for his innovative work. He has worked with leading companies to bring his inventions to life and make a positive impact on society.

Collaborations: Chung Hsien Hsin has collaborated with top researchers, engineers, and scientists from around the world to push the boundaries of technology and create cutting-edge solutions to complex problems. His collaborative efforts have led to the development of revolutionary products that have changed the way we live and work.

Conclusion: Chung Hsien Hsin's passion for innovation and his dedication to creating a better future through his inventions have solidified his place as a pioneering inventor in the global community. His work continues to inspire the next generation of inventors to think outside the box and strive for excellence in all their endeavors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]