The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6791842 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 14, 2004

Filed:

Nov. 12, 2002
Applicant:
Inventor:

Chung Hsien Hsin, Hsinchu Hsien, TW;

Assignee:

Kingpak Technology Inc., Hsinchun Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 ; H05K 1/18 ; H05K 7/02 ; H05K 7/06 ; H05K 7/08 ;
U.S. Cl.
CPC ...
H05K 1/00 ; H05K 1/18 ; H05K 7/02 ; H05K 7/06 ; H05K 7/08 ;
Abstract

An image sensor includes a substrate, a frame layer, signal input terminals, a photosensitive chip, a transparent layer, a plurality of wires and a glue layer. The substrate has a first surface and a second surface. The frame layer is placed on the first surface to form a cavity together with the substrate. The signal input terminals are formed on the frame layer. The photosensitive chip has plural bonding pads, and is placed on the first surface of the substrate and positioned within the cavity. The transparent layer is placed over the frame layer to define, in the cavity, at least one exposure area through which the bonding pads of the photosensitive chip are exposed. The wires penetrate through the exposure area and electrically connect the bonding pads to the signal input terminals. The glue layer covers the exposure area to seal the plurality of wires.


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Hsin, Chung. (2004). Image sensor structure (U.S. Patent No. 6791842). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6791842

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