The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Jul. 16, 2003
Applicant:
Chung Hsien Hsin, Hsinchu Hsien, TW;
Inventor:
Chung Hsien Hsin, Hsinchu Hsien, TW;
Assignee:
Kingpak Technology Inc., Hsinchu Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip. And a transparent layer is fixed and encapsulated by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer.
Quick Actions:
Hsin, Chung. (2008). Image sensor and method for manufacturing the same (U.S. Patent No. 7440263). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7440263
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile