The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Feb. 07, 2005
Chung Hsien Hsin, Hsinchu Hsien, TW;
Tony Wang, Hsinchu Hsien, TW;
Worrell Tsai, Hsinchu Hsien, TW;
Figo Hsieh, Hsinchu Hsien, TW;
Wei Chang, Hsinchu Hsien, TW;
Jun Jie Yen, Hsinchu Hsien, TW;
Chung Hsien Hsin, Hsinchu Hsien, TW;
Tony Wang, Hsinchu Hsien, TW;
Worrell Tsai, Hsinchu Hsien, TW;
Figo Hsieh, Hsinchu Hsien, TW;
Wei Chang, Hsinchu Hsien, TW;
Jun Jie Yen, Hsinchu Hsien, TW;
Kingpak Technology Inc., Hsinchu Hsien, TW;
Abstract
An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four posts are arranged on the four angle of the upper surface of the substrate individually. The photosensitive chip is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrodes of the substrate. The glue layer is surrounded to the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires. The transparent layer is arranged onto the four posts and the glue layer to cover the photosensitive chip.