The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7368795 B1

PDF
Full Text
Expired
Date of Patent:
May. 06, 2008

Filed:

Dec. 22, 2005
Applicant:

Chung Hsien Hsin, Hsinchu Hsien, TW;

Inventor:

Chung Hsien Hsin, Hsinchu Hsien, TW;

Assignee:

Kingpak Technology Inc., Hsinchu Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second surface and a penetrated hole. The second surface of the substrate is mounted on the upper surface of the circuit board so that the passive component is located within the penetrated hole. A chip is mounted on the first surface of the substrate, and is located onto the penetrated hole. Wires are electrically connected to the chip and the substrate. A lens holder is mounted on the first surface of the substrate and formed with an internal thread. A lens barrel is formed with an external thread screwed on the internal thread and is formed with an opening, an aspheric lens and an infrared filter.


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Hsin, Chung. (2008). Image sensor module with passive component (U.S. Patent No. 7368795). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7368795

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