For the Inventor, By the Inventor

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South Bend, IN, United States of America

Indiana Integrated Circuits, LLC

USPTO Granted Patents = 16

EPO Patents = 1

Trademarks = 1

Forward Citations = 18

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20 inventors (with patents filed for the assignee):

Jason M Kulick (15 out of 17 patents)

Tian Lu (12 out of 12 patents)

Stefan Preble (2 out of 7 patents)

4. Jeffrey Steidle (2 out of 4 patents)

5. Robert Joseph Engelhardt, Jr (2 out of 2 patents)

6. Yi Qian (2 out of 6 patents)

7. Michael Fanto (2 out of 12 patents)

8. Scott Goodwin (1 out of 35 patents)

9. Carlos J Ortega (1 out of 1 patent)

10. John Philip Timler (1 out of 8 patents)

11. Douglas C Hall (1 out of 5 patents)

12. Gary H Bernstein (1 out of 18 patents)

13. Anthony Hoffman (1 out of 3 patents)

14. Scott Howard (1 out of 6 patents)

15. Alexei Orlov (1 out of 3 patents)

16 patents: Sort by Forward Citations

1. 11658432 - Edge interconnects for use with circuit boards and integrated circuits (2023-05-23),

2. 11523511 - Assembling and handling edge interconnect packaging system (2022-12-06),

3. 11488660 - Adiabatic flip-flop and memory cell design (2022-11-01),

4. 11398463 - Edge interconnect self-assembly substrate (2022-07-26),

5. 11224126 - Edge interconnects for use with circuit boards and integrated circuits (2022-01-11),

6. 10945335 - Assembling and handling edge interconnect packaging system (2021-03-09),

7. 10896898 - Edge interconnect self-assembly substrate (2021-01-19),

8. 10598861 - Method and system to passively align and attach fiber array to laser array or optical waveguide array (2020-03-24),

9. 10410989 - Inter-chip alignment (2019-09-10),

10. 10409004 - Method and system to passively align and attach fiber array to laser array or optical waveguide array (2019-09-10),

11. 10325875 - Edge interconnect packaging of integrated circuits for power systems (2019-06-18),

12. 10182498 - Substrates with interdigitated hinged edge interconnects (2019-01-15),

13. 10056335 - Prototyping of electronic circuits with edge interconnects (2018-08-21),

14. 9844139 - Method of interconnecting microchips (2017-12-12),

15. 9806030 - Prototyping of electronic circuits with edge interconnects (2017-10-31),

Indiana Integrated Circuits, LLC is a leading electronics manufacturing company specializing in the design and fabrication of custom integrated circuits. With several years of industry experience, we offer a wide range of advanced solutions for various applications including automotive, consumer electronics, medical devices, and more. Our team of highly skilled engineers and technicians is committed to delivering high-quality, innovative semiconductor solutions to meet our customers' unique requirements. Visit our website for more information and to explore our product portfolio.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

16 Patents

#6 in South Bend, IN

#296 in Indiana

#19,269 in US

#36,651 in the World

South Bend, IN, United States of America

Indiana Integrated Circuits, LLC

Forward Citations = 18

20 inventors:

Jason M Kulick (15 out of 17 patents)

Tian Lu (12 out of 12 patents)

Stefan Preble (2 out of 7 patents)

4. Jeffrey Steidle (2 out of 4 patents)

5. Robert Joseph Engelhardt, Jr (2 out of 2 patents)

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