The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2019
Filed:
Oct. 17, 2016
Applicant:
Indiana Integrated Circuits, Llc, South Bend, IN (US);
Inventors:
Jason M. Kulick, South Bend, IN (US);
Tian Lu, Osceola, IN (US);
Assignee:
Indiana Integrated Circuits, LLC, South Bend, IN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/148 (2013.01); H01L 23/5385 (2013.01);
Abstract
A quilt packaging system includes a first microchip substrate having a first edge surface which includes a first conductive interconnecting structure disposed thereon and a second microchip substrate having a first edge surface which includes a second conductive interconnecting structure disposed thereon. The first conductive interconnecting structure is hingedly connected in an interdigitated manner with the second conductive interconnecting structure at an angle that is not a straight angle.