The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Jan. 09, 2020
Indiana Integrated Circuits, Llc, South Bend, IN (US);
Science Applications International Corporation, Reston, VA (US);
Jason M. Kulick, South Bend, IN (US);
Tian Lu, Osceola, IN (US);
Carlos J. Ortega, Goshen, IN (US);
Robert Joseph Engelhardt, Jr., Broomfield, CO (US);
John Philip Timler, River Ridge, LA (US);
Indiana Integrated Circuits, LLC, South Bend, IN (US);
Science Applications International Corporation, Reston, VA (US);
Abstract
A substrate assembly includes at least one printed circuit (PC) substrate. Each PC substrate includes a PC top surface and a PC bottom surface spaced from each other and an edge that runs at least partially about a periphery of the PC substrate between the PC top surface and the PC bottom surface. The edge includes or defines on a facet or edge surface of the edge at least one projection that extends transverse or normal to the facet or edge surface. The projection includes a projection top surface and a projection bottom surface spaced from each other and the projection can include or be made of conductive material.