The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Oct. 25, 2016
Applicant:
Indiana Integrated Circuits, Llc, South Bend, IN (US);
Inventors:
Jason M. Kulick, South Bend, IN (US);
Tian Lu, Osceola, IN (US);
Assignee:
Indiana Integrated Circuits, LLC, South Bend, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 29/06 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 29/0657 (2013.01); H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H01L 2225/1064 (2013.01); H01L 2225/1082 (2013.01);
Abstract
A substrate assembly includes a first microchip including a first interconnecting structure and a second microchip including a second interconnecting structure, wherein the first and second interconnecting structures have keyed complementary, interlocking shapes. The first interconnecting structure is interlocked with the second interconnecting structure. Quilt package nodules on edges of the first and second microchips electrically connect circuitry formed on or supported by the first and second microchips.