The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Apr. 21, 2017
Applicants:

University of Notre Dame Du Lac, Notre Dame, IN (US);

Indiana Integrated Circuits, Llc, South Bend, IN (US);

Inventors:

Douglas C. Hall, South Bend, IN (US);

Gary H. Bernstein, Granger, IN (US);

Anthony Hoffman, South Bend, IN (US);

Scott Howard, South Bend, IN (US);

Jason M. Kulick, South Bend, IN (US);

Assignees:

University of Notre Dame du Lac, Notre Dame, IN (US);

Indiana Integrated Circuits, LLC, South Bend, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/60 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 29/06 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/67 (2013.01); H01L 23/60 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/66 (2013.01); H01L 24/72 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 29/0657 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81224 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01); H05K 3/326 (2013.01); H05K 3/328 (2013.01); H05K 2201/0314 (2013.01); H05K 2201/10454 (2013.01); H05K 2201/10909 (2013.01); Y02P 70/611 (2015.11);
Abstract

First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.


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