The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Nov. 04, 2020
Indiana Integrated Circuits, Llc, South Bend, IN (US);
Jason M. Kulick, South Bend, IN (US);
Tian Lu, Osceola, IN (US);
Indiana Integrated Circuits, LLC, South Bend, IN (US);
Abstract
A method of forming a quilt package nodule includes forming a trench in a microchip substrate, forming a metal layer on the bottom, the first and second sides of the trench, and on a top surface of the microchip substrate proximate the first and second sides. forming a mask layer on the metal layer, removing portions of the mask and metal layers on the bottom of the trench, etching the bottom of the trench to increase the depth of the bottom of the trench, removing remaining portions of the mask layer from the metal layer to define the quilt package nodules that protrude beyond edges of the first and second sides, and removing the remaining portion of the trench bottom thereby separating the first and second sides from each other, whereupon each side includes at least one quilt package nodule protruding from the side.