The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Sep. 10, 2019
Applicants:

Indiana Integrated Circuits, Llc, South Bend, IN (US);

Rochester Institute of Technology, Rochester, NY (US);

Mrsi Systems, Llc, N. Billerica, MA (US);

Inventors:

Jason M. Kulick, South Bend, IN (US);

Yi Qian, Acton, MA (US);

Stefan Preble, Pittsford, NY (US);

Jeffrey Steidle, Geneseo, NY (US);

Michael Fanto, Rome, NY (US);

Tian Lu, Osceola, IN (US);

Assignees:

Indiana Integrated Circuits, LLC, South Bend, IN (US);

MRSI Systems, LLC, N. Billerica, MA (US);

Rochester Institute of Technology, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/30 (2006.01); G02B 6/293 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/305 (2013.01); G02B 6/2938 (2013.01); G02B 6/4232 (2013.01);
Abstract

Disclosed is a method and system for passively aligning optical fibers (), a first waveguide array (), and a second waveguide array () using chip-to-chip vertical evanescent optical waveguides () and (), that can be used with fully automated die bonding equipment. The assembled system () can achieve high optical coupling and high process throughput for needs of high volume manufacturing of photonics, silicon photonics, and other applications that would benefit from aligning optical fibers to lasers efficiently.


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