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Trademarks = 1

Forward Citations = 14

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8 inventors (with patents filed for the assignee):

Nicholas Samuel Celia, Jr (5 out of 5 patents)

Cyriac Devasia (3 out of 5 patents)

Jason M Kulick (2 out of 17 patents)

4. Tian Lu (2 out of 12 patents)

5. Stefan Preble (2 out of 7 patents)

6. Jeffrey Steidle (2 out of 4 patents)

7. Yi Qian (2 out of 6 patents)

8. Michael Fanto (2 out of 12 patents)

7 patents: Sort by Forward Citations

1. 12532703 - Self-aligning tip (2026-01-20),

2. 12237202 - Die bonding system with heated automatic collet changer (2025-02-25),

3. 11791197 - Die bonding system with wafer lift and level assembly (2023-10-17),

4. 10598861 - Method and system to passively align and attach fiber array to laser array or optical waveguide array (2020-03-24),

5. 10588981 - Die placement head with turret (2020-03-17),

6. 10409004 - Method and system to passively align and attach fiber array to laser array or optical waveguide array (2019-09-10),

7. 9911710 - Thermo-compression bonding system, subsystems, and methods of use (2018-03-06),

Mrsi Systems, LLC is a leading provider of advanced die bonder equipment for the semiconductor industry. With over 30 years of experience, Mrsi Systems offers innovative solutions for high-precision die bonding, flip chip, and advanced packaging applications. Their systems are known for their reliability, accuracy, and versatility, making them a trusted choice for semiconductor manufacturers worldwide.

Profile summary based on public USPTO records.