The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Aug. 20, 2021
Applicant:
Mrsi Systems Llc, Tewksbury, MA (US);
Inventors:
Nicholas Samuel Celia, Jr., Avon, MA (US);
Cyriac Devasia, Nashua, NH (US);
Assignee:
MRSI Systems LLC, Tewksbury, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); H01L 21/687 (2013.01); H01L 21/68742 (2013.01);
Abstract
A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.