The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Dec. 13, 2021
Mrsi Systems Llc, Tewksbury, MA (US);
Dennis Carew, Burlington, MA (US);
Julius Ortega, Lowell, MA (US);
MRSI Systems LLC, Tewksbury, MA (US);
Abstract
A die bonding system uses an inert gas chamber having a bottom aperture through which a heater assembly can insert a part for bonding, a cover having a top aperture through which a die bond head can insert and bond a die to the part, and a plurality of apertures through a base of the inert gas chamber through which a forming gas is bled through to evacuate the chamber of oxygen before performing a die bonding operation, reducing the potential for oxidation while maintaining cycle times suitable for use in a production environment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile