The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Feb. 27, 2023
Applicant:
Mrsi Systems Llc, Tewksbury, MA (US);
Inventor:
Nicholas Samuel Celia, Jr., Avon, MA (US);
Assignee:
MRSI Systems LLC, Tewksbury, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); B23Q 3/155 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); B23Q 3/15513 (2013.01); H01L 21/6838 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 2224/75843 (2013.01); H01L 2224/81191 (2013.01);
Abstract
A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.