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Tempe, AZ, United States of America

Icemos Technology Corporation

USPTO Granted Patents = 48

Trademarks = 2

Forward Citations = 147

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11 inventors (with patents filed for the assignee):

Hugh J Griffin (27 out of 28 patents)

Robin Wilson (24 out of 24 patents)

Conor Brogan (22 out of 22 patents)

4. Cormac MacNamara (22 out of 23 patents)

5. Samuel Anderson (15 out of 55 patents)

6. Takeshi Ishiguro (15 out of 24 patents)

7. Kiraneswar Muthuseenu (5 out of 5 patents)

8. Kenji Sugiura (5 out of 100 patents)

9. Koon Chong So (4 out of 67 patents)

10. Xu Cheng (2 out of 18 patents)

11. Hiugh J Griffin (1 out of 1 patent)

Core Competencies:

Radiation Hardened MOSFET

Superjunction Devices

Biosensor Semiconductor

Graphene Power MOSFETs

Trench Type Semiconductor

Photodetector Array

Thin Substrate Processing

Wafer Bonding Techniques

PIN Diode

Dielectric Termination

Through-Wafer Vias

Isolation Diffusions

48 patents: Sort by Forward Citations

1. 12230674 - Radiation hardened high voltage superjunction MOSFET (2025-02-18),

2. 12222316 - Semiconductor device providing a biosensor to test for pathogen (2025-02-11),

3. 11935839 - Semiconductor device with oxide-nitride stack (2024-03-19),

4. 11757001 - Radiation hardened high voltage superjunction MOSFET (2023-09-12),

5. 11545565 - Semiconductor device and method of forming low voltage power MOSFETs using graphene for metal layers and graphene nanoribbons for channel and drain enhancement regions of power vertical and lateral MOSFETs (2023-01-03),

6. 11362179 - Radiation hardened high voltage superjunction MOSFET (2022-06-14),

7. 11362042 - Semiconductor device with oxide-nitride stack (2022-06-14),

8. 9576842 - Grass removal in patterned cavity etching (2017-02-21),

9. 9461109 - Method of forming superjunction high voltage devices using wafer bonding (2016-10-04),

10. 9147751 - Methods of manufacturing superjunction devices (2015-09-29),

11. 8963239 - 800 V superjunction device (2015-02-24),

12. 8946814 - Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates (2015-02-03),

13. 8895369 - Methods for manufacturing superjunction semiconductor device having a dielectric termination (2014-11-25),

14. 8736019 - Semiconductor devices with sealed, unlined trenches and methods of forming same (2014-05-27),

15. 8716829 - Semiconductor devices with sealed, unlined trenches and methods of forming same (2014-05-06),

IceMos Technology Corporation is a leading provider of semiconductor solutions for wireless communication devices. With its cutting-edge technology and extensive experience in the industry, IceMos Technology Corporation offers a wide range of integrated circuits and modules for various applications, including mobile phones, tablets, and IoT devices. The company is committed to delivering innovative and reliable solutions to meet the growing demands of the connected world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

48 Patents

#14 in Tempe, AZ

#89 in Arizona

#7,025 in US

#14,124 in the World

Tempe, AZ, United States of America

Icemos Technology Corporation

Forward Citations = 147

11 inventors:

Hugh J Griffin (27 out of 28 patents)

Robin Wilson (24 out of 24 patents)

Conor Brogan (22 out of 22 patents)

4. Cormac MacNamara (22 out of 23 patents)

5. Samuel Anderson (15 out of 55 patents)

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