Hiugh J Griffin

Title: Hiugh J Griffin: Innovator in Semiconductor Technology

Introduction

Hiugh J Griffin is a notable inventor based in Newtownabbey, GB. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work focuses on enhancing the manufacturing processes of semiconductor devices, which are crucial in modern electronics.

Latest Patents

Griffin holds a patent for a "Silicon wafer having through-wafer vias." This patent describes a method of manufacturing a semiconductor device that includes providing a semiconductor substrate with first and second main surfaces opposite to each other. A trench is formed in the semiconductor substrate at the first main surface, extending to a first depth position. The trench is lined with dielectric material and filled with conductive material. An electrical component is then electrically connected to the conductive material exposed at the first main surface, and a cap is mounted to enclose the electrical component and the electrical connection.

Career Highlights

Griffin is associated with Icemos Technology Corporation, where he applies his expertise in semiconductor manufacturing. His innovative approach has contributed to advancements in the industry, making him a valuable asset to his company.

Collaborations

Some of his coworkers include Cormac MacNamara and Conor Brogan, who collaborate with Griffin on various projects within the company.

Conclusion

Hiugh J Griffin's contributions to semiconductor technology through his patent demonstrate his innovative spirit and commitment to advancing the field. His work continues to influence the development of modern electronic devices.