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China Wafer Level Csp Co., Ltd.

USPTO Granted Patents = 26

Forward Citations = 19

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15 inventors (with patents filed for the assignee):

Zhiqi Wang (24 out of 27 patents)

Wei Wang (13 out of 39 patents)

Qiong Yu (12 out of 12 patents)

4. Guoliang Xie (5 out of 5 patents)

5. Zhuowei Wang (3 out of 3 patents)

6. Hanqing Hu (2 out of 2 patents)

7. Ying Yang (2 out of 2 patents)

8. Zhi-Qi Wang (2 out of 2 patents)

9. Zhiming Geng (1 out of 1 patent)

10. Yuanfei Liu (1 out of 1 patent)

11. Hongjun Liu (1 out of 1 patent)

12. Fangyuan Hong (1 out of 1 patent)

13. Yuanhao Xu (1 out of 1 patent)

14. Xianglong Liu (1 out of 1 patent)

15. Junjie Li (1 out of 6 patents)

26 patents: Sort by Forward Citations

1. 11049899 - Encapsulation structure of image sensing chip, and encapsulation method therefor (2021-06-29),

2. 10817700 - Optical fingerprint recognition chip package and packaging method (2020-10-27),

3. 10763293 - Image sensing chip package and image sensing chip packaging method (2020-09-01),

4. 10685917 - Semiconductor device and manufacture method of the same (2020-06-16),

5. 10680033 - Chip packaging method and chip package (2020-06-09),

6. 10541264 - Package-on-package structure and package-on-package method (2020-01-21),

7. 10541262 - Image sensing chip packaging structure and packaging method (2020-01-21),

8. 10541186 - Chip package and chip packaging method (2020-01-21),

9. 10529758 - Packaging method and packaging structure (2020-01-07),

10. 10497728 - Fingerprint sensing chip packaging method and fingerprint sensing chip package (2019-12-03),

11. 10490583 - Packaging structure and packaging method (2019-11-26),

12. 10418296 - Semiconductor chip package structure and packaging method therefor (2019-09-17),

13. 10325946 - Packaging method and package structure for image sensing chip (2019-06-18),

14. 10283483 - Packaging method and package structure for image sensing chip (2019-05-07),

15. 10276540 - Chip packaging method and chip packaging structure (2019-04-30),

China Wafer Level CSP Co., Ltd. is a leading semiconductor packaging solutions provider based in China. With a strong focus on wafer-level chip scale packaging technology, the company offers a wide range of customized solutions for various electronic devices. Their expertise includes advanced packaging processes, integrated circuit design, and testing services. China Wafer Level CSP Co., Ltd. is committed to delivering high-quality and cost-effective solutions to meet the unique packaging requirements of their global customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

26 Patents

#24 in Jiangsu

#1,036 in China

#24,040 in the World

China Wafer Level Csp Co., Ltd.

Forward Citations = 19

15 inventors:

Zhiqi Wang (24 out of 27 patents)

Wei Wang (13 out of 39 patents)

Qiong Yu (12 out of 12 patents)

4. Guoliang Xie (5 out of 5 patents)

5. Zhuowei Wang (3 out of 3 patents)

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