The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Nov. 27, 2018
Applicant:
China Wafer Level Csp Co., Ltd., Suzhou, Jiangsu, CN;
Inventor:
Zhiqi Wang, Jiangsu, CN;
Assignee:
China Wafer Level CSP Co., Ltd., Suzhou, Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 23/5389 (2013.01); H01L 27/1462 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01);
Abstract
An image sensing chip package and an image sensing chip packaging method are provided. In the image sensing chip package, an image sensing chip is located in a through hole of a substrate, and a front surface of the image sensing chip is flush with a first surface of the substrate. In this way, in the image sensing chip package, a height of the image sensing chip is controlled with the first surface of the substrate as a reference. Since the first surface of the substrate does not change in the packaging process, almost no uncontrollable factor affects the height of the image sensing chip.