Zhiming Geng

Title: Innovative Contributions of Zhiming Geng in Image Sensing Technology

Introduction

Zhiming Geng is a notable inventor based in Jiangsu, China, recognized for his significant contributions to the field of image sensing technology. He has successfully patented an innovative encapsulation structure and method for image sensor chips, which enhances the performance and efficiency of image capturing devices.

Latest Patents

Geng holds a patent for his invention titled "Encapsulation structure of image sensing chip, and encapsulation method therefor". This invention encompasses a unique packaging structure for image sensor chips, comprising an image sensor chip and a substrate. The design features a first surface with multiple pixels that collect image information, paired with first bonding pads. The substrate efficiently connects with these components through an anisotropic conductive adhesive, ensuring optimal functionality without interfering with pixel operation.

Career Highlights

Zhiming Geng currently works at China Wafer Level CSP Co., Ltd. His role involves pioneering advancements in image sensor technology, allowing for enhanced image quality and processing speeds in various applications. With only one patent to his name so far, his work and inventions indicate a promising future in the tech industry.

Collaborations

Geng collaborates with Zhiqi Wang, a fellow innovator, to drive forward their research and development efforts. Together, they explore new avenues in semiconductor technology, working to refine and enhance their inventions further.

Conclusion

Zhiming Geng is a distinguished inventor whose work in image sensing technology illustrates the importance of innovation in modern electronics. His patented encapsulation method not only showcases his technical expertise but also contributes to the advancement of imaging systems. As technology continues to evolve, Geng's contributions are expected to influence the future of image sensing significantly.