logo

For the Inventor, By the Inventor

Suzhou, China

Qiong Yu

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal12 out of 26 
 
China Wafer Level Csp Co., Ltd.
 patents

Years Active: 2016-2020

Loading Chart...
12 patents (USPTO):Explore Patents
1. 10529758 - Packaging method and packaging structure (2020-01-07),
2. 10133907 - Fingerprint recognition chip packaging structure and packaging method (2018-11-20),
3. 10126151 - Wafer-level chip package structure and packaging method (2018-11-13),
4. 10108837 - Fingerprint recognition chip packaging structure and packaging method (2018-10-23),
5. 10096643 - Fingerprint recognition chip packaging structure and packaging method (2018-10-09),
6. 10090217 - Chip packaging method and package structure (2018-10-02),
7. 9748162 - Chip to wafer package with top electrodes and method of forming (2017-08-29),
8. 9601531 - Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions (2017-03-21),
9. 9455298 - Wafer-level packaging method of BSI image sensors having different cutting processes (2016-09-27),
10. 9305961 - Wafer-level packaging method of BSI image sensors having different cutting processes (2016-04-05),
11. 9299735 - Image sensor package structure and method (2016-03-29),
12. 9231018 - Wafer level packaging structure for image sensors and wafer level packaging method for image sensors (2016-01-05),

Title: Innovative Contributions of Qiong Yu in Image Sensor Packaging

Introduction

Qiong Yu, an inventive mind based in Suzhou, China, has made significant strides in the field of imaging technology through innovative packaging solutions. With a total of 12 patents to his name, Yu's work continues to influence the development of advanced imaging devices and sensor technologies.

Latest Patents

Two of Qiong Yu's latest patents focus on packaging methods that enhance the functionality of image sensors. The first patent deals with a packaging method and packaging structure for forming an image sensor package. The process involves providing a first substrate and a second substrate, with adhesive layers facilitating their attachment. By creating grooves and cavities, this method ensures that the sensing region is effectively integrated, advancing the efficiency of image processing.

The second patent addresses a fingerprint recognition chip packaging structure and its method. This innovation features a sensor chip with a specialized sensing area, where a polymer capping layer protects the sensor, improving sensitivity and broadening potential applications. The integration of a lamination layer further enhances this structure, making it adaptable for various technical requirements.

Career Highlights

Qiong Yu is associated with China Wafer Level CSP Co., Ltd., where he continues to push the boundaries of packaging technology. His contributions have not only secured his place as a prolific inventor but have also positioned his company at the forefront of innovative imaging solutions.

Collaborations

In his pursuit of innovation, Yu collaborates closely with coworkers Wei Wang and Zhiqi Wang. Together, they form a dynamic team that drives forward-thinking projects within the company, fostering a culture of creativity and technical advancement.

Conclusion

With a commitment to enhancing imaging technology through novel packaging methods, Qiong Yu exemplifies the role of modern inventors in shaping the future of sensor technologies. His patents serve as a testament to his expertise and innovative spirit, promising continued advancements in this vital field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…