The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Sep. 10, 2015
Applicant:
China Wafer Level Csp Co., Ltd., Suzhou, Jiangsu, CN;
Inventors:
Assignee:
China Wafer Level CSP Co., Ltd., Suzhou, Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); G01D 11/24 (2006.01); H01L 23/48 (2006.01); G06K 9/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); G06K 9/0002 (2013.01); H01L 23/48 (2013.01); H01L 21/561 (2013.01); H01L 23/3114 (2013.01); H01L 2224/11 (2013.01);
Abstract
A chip package structure and packaging method are provided. The chip package structure includes a sensing chip, a covering layer located on the first surface of the sensing chip, and a plug structure located in the sensing chip. The sensing chip includes a first surface, a second surface opposite to the first surface, and a sensing area located on the first surface. The second surface of the sensing chip faces to a base plate. One end of the plug structure is electrically connected to the sensing area, and the other end of the plug structure is exposed by the second surface of the sensing chip.