The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Jun. 30, 2015
China Wafer Level Csp Co., Ltd., Suzhou, CN;
China Wafer Level CSP Co., Ltd., Suzhou, Jiangsu, CN;
Abstract
A fingerprint recognition chip packaging structure and a packaging method. The packaging structure includes: a substrate, which is provided with a substrate surface; a sensor chip coupled on the surface of the substrate, where the sensor chip is provided with a first surface and a second surface opposite the first surface, the first surface of the sensor chip is provided with a sensing area, and the second surface of the sensor chip is arranged on the surface of the substrate; and, a lamination layer arranged on the surface of the substrate and on the surface of the sensor chip, where the lamination layer covers the surface of the sensing area of the sensor chip, a portion of the lamination layer located at the surface of the sensing area is of a preset thickness, and the material of the lamination layer is a polymer.