China Wafer Level Csp Co., Ltd.

Qiong Yu

Wei Wang

Zhiqi Wang

Zhi-Qi Wang

Junjie Li

Ying Yang

A method for forming an image sensor package and an image sensor package are provided. The method includes: providing a first substrate and a second substrate which includes a first surface and a second surface opposite to the first surface, and attaching either surface of the first substrate with the first surface of the second substrate with an adhesive layer; forming a groove at the second surface of the second substrate; providing a base which includes a first surface and a second surface opposite to the first surface, where the first surface of the base is provided with a sensing region and multiple contact pads; and attaching the second surface of the second substrate with the first surface of the base, where a cavity is formed between the groove and the base, and the sensing region is located within the cavity.

Packaging method and packaging structure

A fingerprint recognition chip packaging structure and a packaging method. The packaging structure includes: a substrate provided with a substrate surface; a sensor chip coupled on the surface of the substrate, where the sensor chip is provided with a first surface and a second surface opposite the first surface, the first surface of the sensor chip is provided with a sensing area, and the second surface of the sensor chip is arranged on the surface of the substrate; a capping layer arranged on the surface of the sensing area of the sensor chip, where the material of the capping layer is a polymer; and, a lamination layer arranged on the surface of the substrate and that of the sensor chip, where the lamination layer exposes the capping layer. The packaging structure allows for reduced requirements on the sensitivity of the sensor chip, thus broadening applications.

Fingerprint recognition chip packaging structure and packaging method

A chip package structure and packaging method are provided. The chip package structure includes a sensing chip, a covering layer located on the first surface of the sensing chip, and a plug structure located in the sensing chip. The sensing chip includes a first surface, a second surface opposite to the first surface, and a sensing area located on the first surface. The second surface of the sensing chip faces to a base plate. One end of the plug structure is electrically connected to the sensing area, and the other end of the plug structure is exposed by the second surface of the sensing chip.

Wafer-level chip package structure and packaging method

A fingerprint recognition chip packaging structure and a packaging method. The packaging structure includes: a substrate, which is provided with a substrate surface; a sensor chip coupled on the surface of the substrate, where the sensor chip is provided with a first surface and a second surface opposite the first surface, the first surface of the sensor chip is provided with a sensing area, and the second surface of the sensor chip is arranged on the surface of the substrate; and, a lamination layer arranged on the surface of the substrate and on the surface of the sensor chip, where the lamination layer covers the surface of the sensing area of the sensor chip, a portion of the lamination layer located at the surface of the sensing area is of a preset thickness, and the material of the lamination layer is a polymer.

A packaging structure and a packaging method for a fingerprint identification chip are provided. The packaging structure includes a substrate, a sensing chip, a wire and a plastic encapsulation layer. The substrate is provided with a first solder pad layer. The sensing chip has a first surface and a second surface opposite to the first surface, the first surface comprises a sensing area and a peripheral area surrounding the sensing area, and the surface of the sensing chip in the peripheral area is provided with a second solder pad layer. Two ends of the wire are electrically connected to the first solder pad layer and the second solder pad layer respectively. The plastic encapsulation layer is made of a polymer, the plastic encapsulation layer surrounds the wire and the sensing chip.

A chip packaging method and package structure, the package structure including a substrate, a sensing chip coupled to the substrate, a plastic package layer located on the substrate, and a covering layer located on the plastic package layer and a first surface of the sensing chip; the sensing chip including the first surface and a second surface opposite to the first surface, and further including a sensing area located on the first surface; the second surface of the sensing chip faces towards the substrate; and the plastic package layer encloses the sensing chip, and the surface of the plastic package layer is flush with the first surface of the sensing chip.

Chip packaging method and package structure

A chip package and a method for forming the same are provided. The method includes: providing a first chip, wherein the first chip comprises a first surface and a second surface, and a first plurality of pads are disposed on the first surface; providing a second chip, wherein the second chip comprises a third surface and a fourth surface, a second plurality of pads are disposed on the third surface; combining the second surface of the first chip and the third surface of the second chip, wherein the second plurality of pads are out of the combination area of the first chip and the second chip; and forming a first insulation layer, wherein the first insulation layer covers the first chip, and is combined with the second chip. Processes of the method are simple, and the chip package is small.

Chip to wafer package with top electrodes and method of forming

A wafer level packaging structure for image sensors and a wafer level packaging method for image sensors are provided. The wafer level packaging structure includes: a wafer to be packaged including multiple chip regions and scribe line regions between the chip regions; pads and image sensing regions located on a first surface of the wafer and located in the chip regions; first dike structures covering surfaces of the pads and the scribe line regions; a packaging cover arranged facing the first surface of the wafer; and second dike structures located on a surface of the packaging cover. The second dike structures are arranged corresponding to the scribe line regions. The packaging cover and the wafer are jointed fixedly via the second dike structures and the first dike structures.

Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions

A wafer-level packaging method of BSI image sensors includes the following steps: Sproviding a wafer package body comprising a silicon base, an interconnect layer, a hollow wall and a substrate; Scutting the wafer package body via laser in a first cutting process to separate the interconnect layer of adjacent BSI image sensors; and Scutting the wafer package body via a blade in a second cutting process to obtain independent BSI image sensors. As a result, damage of the interconnect layer and the substrate may be decreased to improve performance and reliability of the BSI image sensor.

Wafer-level packaging method of BSI image sensors having different cutting processes

A wafer-level packaging method of BSI image sensors includes the following steps: S1: providing a wafer package body comprising a silicon base, an interconnect layer, a hollow wall and a substrate; S2: cutting the wafer package body via a first blade in a first cutting process to separate the interconnect layer of adjacent BSI image sensors; and S3: cutting the wafer package body via a second blade in a second cutting process to obtain independent BSI image sensors. As a result, damage of the interconnect layer and the substrate may be decreased to improve performance and reliability of the BSI image sensor.

Image sensor package structure and method are provided. The method includes: providing first substrate having upper surface on which image sensing areas and pads are formed; providing second substrate having through holes; forming tape film on upper surface of second substrate to seal each through hole; contacting lower surface of second substrate with upper surface of first substrate to make image sensing areas in through holes; removing portions of tape film and second substrate, wherein remained tape film and second substrate form cavities including sidewalls made of second substrate and caps sealing sidewalls and made of tape film, and remained second substrate also covers pads; removing portions of remained second substrate to expose pads; slicing first substrate to form single image sensor chips including image sensing areas and pads; and electrically connecting pads with circuits on third substrate through wires. Pollution or damage to image sensing areas may be avoided.

Image sensor package structure and method

A wafer level packaging structure for image sensors and a wafer level packaging method for image sensors are provided. The wafer level packaging structure includes: a wafer to be packaged including multiple chip regions and scribe line regions between the chip regions; pads and image sensing regions located on a first surface of the wafer and located in the chip regions; first dike structures covering surfaces of the pads; a packaging cover arranged facing the first surface of the wafer; and second dike structures located on a surface of the packaging cover. Projections of the second dike structures onto the first surface of the wafer are included in the scribe line regions. The packaging cover and the wafer are jointed fixedly via the second dike structures, while tops of the first dike structures and the surface of the packaging cover are contacted.

Growing community of inventors

Suzhou, China

Qiong Yu