Suzhou, China

Zhi-Qi Wang


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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2 patents (USPTO):Explore Patents

Title: Innovations of Inventor Zhi-Qi Wang in Wafer-Level Packaging Technology

Introduction: Zhi-Qi Wang is a notable inventor based in Suzhou, China, who has made significant contributions to the field of wafer-level packaging, particularly for BSI (Back-Side Illuminated) image sensors. With a total of two patents to his name, Zhi-Qi's work focuses on enhancing the performance and reliability of image sensors through innovative cutting processes.

Latest Patents: Zhi-Qi Wang's latest patents revolve around a wafer-level packaging method for BSI image sensors utilizing different cutting processes. The first method involves providing a wafer package body that includes a silicon base, an interconnect layer, a hollow wall, and a substrate. The process then entails cutting this package body with a laser in the first cutting phase, which separates the interconnect layer of adjacent BSI image sensors. Following this, a blade is used in a second cutting process to yield independent BSI image sensors. Such techniques are crucial as they minimize damage to the interconnect layer and substrate, thereby enhancing the overall performance and reliability of the BSI image sensors.

Career Highlights: Zhi-Qi Wang is currently affiliated with China Wafer Level CSP Co., Ltd., a company renowned for its advancements in wafer-level packaging technology. His innovative approach to cutting processes in sensor manufacturing has garnered significant attention in the field, contributing to the company's reputation as a leader in this niche.

Collaborations: Throughout his career, Zhi-Qi has had the opportunity to collaborate with talented individuals such as Qiong Yu and Wei Wang. These collaborations have led to shared advancements in technology and have further improved the development of BSI image sensors.

Conclusion: Zhi-Qi Wang stands out as a prominent figure in the realm of wafer-level packaging technologies. With his innovative patents and collaborative efforts, he continues to make strides in improving the functionality and reliability of BSI image sensors, showcasing the impactful role of inventors in advancing technology.

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