China Wafer Level Csp Co., Ltd.

Zhi-Qi Wang

Wei Wang

Qiong Yu

A wafer-level packaging method of BSI image sensors includes the following steps: Sproviding a wafer package body comprising a silicon base, an interconnect layer, a hollow wall and a substrate; Scutting the wafer package body via laser in a first cutting process to separate the interconnect layer of adjacent BSI image sensors; and Scutting the wafer package body via a blade in a second cutting process to obtain independent BSI image sensors. As a result, damage of the interconnect layer and the substrate may be decreased to improve performance and reliability of the BSI image sensor.

Wafer-level packaging method of BSI image sensors having different cutting processes

A wafer-level packaging method of BSI image sensors includes the following steps: S1: providing a wafer package body comprising a silicon base, an interconnect layer, a hollow wall and a substrate; S2: cutting the wafer package body via a first blade in a first cutting process to separate the interconnect layer of adjacent BSI image sensors; and S3: cutting the wafer package body via a second blade in a second cutting process to obtain independent BSI image sensors. As a result, damage of the interconnect layer and the substrate may be decreased to improve performance and reliability of the BSI image sensor.

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Suzhou, China

Zhi-Qi Wang