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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10325946 B1

PDFFull Text
Date of Patent:
Jun. 18, 2019

Filed:

Sep. 28, 2016

Packaging method and package structure for image sensing chip

Applicant:

China Wafer Level Csp Co., Ltd., Suzhou, Jiangsu, CN;

Inventors:

Zhiqi Wang, Suzhou, CN;

Zhuowei Wang, Jiangsu, CN;

Guoliang Xie, Jiangsu, CN;

Assignee:

China Wafer Level CSP Co., Ltd., Suzhou, Jiangsu, CN;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Matthew C Landau

Assistant Examiner:

Grant S Withers

Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/492 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 21/50 (2013.01); H01L 23/13 (2013.01); H01L 23/31 (2013.01); H01L 23/49 (2013.01); H01L 23/492 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14638 (2013.01); H01L 27/14687 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0382 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/11 (2013.01); H01L 2224/11019 (2013.01); H01L 2224/13024 (2013.01);
Abstract

A packaging method and a package for an image sensing chip are provided. The packaging method includes: providing a wafer including a first surface and a second surface opposite to the first surface, where the wafer has multiple image sensing chips arranged in a grid, each of the image sensing chips has an image sensing region and contact pads arranged on a side of the first surface; forming an opening corresponding to each of the contact pads and cutting trenches on a side of the second surface of the wafer, where the contact pad is exposed through the opening; filling the cutting trenches with a first photosensitive ink; and applying a second photosensitive ink on the second surface of the wafer to cover the opening with the second photosensitive ink and form a hollow cavity in the opening.

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