The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Nov. 16, 2018
China Wafer Level Csp Co., Ltd., Suzhou, Jiangsu, CN;
Zhiqi Wang, Jiangsu, CN;
China Wafer Level CSP Co., Ltd., Suzhou, Jiangsu, CN;
Abstract
A package-on-package structure of an image sensing chip is provided, which includes: an image sensing chip package, a control chip package and a circuit board. The image sensing chip package and the control chip package are arranged on the same surface of the control chip package in parallel. The image sensing chip package includes a first substrate and an image sensing chip. The control chip package includes a second substrate and a control chip. A second surface of the first substrate is electrically connected to a first region of a first surface of the second substrate, and the circuit board is electrically connected to a second region of the first surface of the second substrate. A package-on-package method for a package-on-package structure is further provided.