The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Aug. 21, 2018
Applicant:
China Wafer Level Csp Co., Ltd., Suzhou, Jiangsu, CN;
Inventor:
Zhiqi Wang, Jiangsu, CN;
Assignee:
China Wafer Level CSP Co., Ltd., Suzhou, Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 25/04 (2014.01); H01L 31/02 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14685 (2013.01); H01L 25/042 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02325 (2013.01);
Abstract
A chip packaging method and a chip package are provided. According to the chip packaging method and the chip package, to-be-packaged chips are located in a plastic packaging layer, and front surfaces of the to-be-packaged chips are flush with a first surface of the plastic packaging layer, and the plastic packaging material for manufacturing the plastic packaging layer has good plasticity before a curing process, so that the formed first surface and the second surface have good smoothness, thereby ensuring the reliability of the package.