Ying Yang

Title: Innovator Ying Yang: Pioneering Advances in Chip Packaging

Introduction: Ying Yang, a prominent inventor based in Suzhou, China, has made significant contributions to the field of chip packaging. With a total of two patents to his name, his work reflects a commitment to innovation and efficiency in semiconductor technology.

Latest Patents: Ying Yang's latest inventions include a chip packaging method and a novel chip packaging structure. The chip packaging method fundamentally involves the integration of a first and a second substrate, where the second substrate features both a top surface and a bottom surface with an adhesive layer adhering the first substrate to the top surface. A unique groove structure is introduced on the bottom surface, with a base incorporated to create a cavity for a sensing region. This innovative setup enhances the functionality and compactness of chip designs.

Another noteworthy patent of his is the "Chip to Wafer Package with Top Electrodes and Method of Forming." This invention outlines a method for assembling a chip package by combining two chips in a manner that allows for a simplified process and reduced size. Specifically, the first chip's surfaces are integrated with the second chip, ensuring that the pads are strategically positioned outside the combination area. The formation of a first insulation layer that overlays the first chip completes the assembly, ensuring both protection and functionality.

Career Highlights: Ying Yang is currently employed at China Wafer Level CSP Co., Ltd., a leader in the semiconductor packaging industry. His work exemplifies cutting-edge advancements in chip technology, underlining his role as an innovator in his field.

Collaborations: Throughout his career, Ying has worked alongside talented colleagues, including Zhiqi Wang and Wei Wang. Their collaborative efforts have propelled innovation and fostered a creative environment conducive to developing groundbreaking solutions in chip packaging.

Conclusion: In summation, Ying Yang's achievements in chip packaging signify noteworthy advancements in semiconductor technology. Through his innovative patents and collaborations, he continues to influence the industry, driving forward the capabilities and efficiencies of chip designs. His dedication and expertise help shape the future of technology in meaningful ways.